H Silicone Thermal Paste – your solution for heat transfer (>0.88 W/mK) with excellent protection
Nowadays, as electronics become increasingly advanced and devices operate under ever-greater loads, efficient heat dissipation is becoming essential. H Silicone Thermal Paste provides, above all, exceptional thermal conductivity of over >0.88 W/mK, ensuring optimal cooling of your devices.
Why H Silicone Thermal Paste?
Our paste has been specially designed to facilitate heat transfer between electronic components and the heatsink. It is an indispensable element in the proper operation of temperature sensors, protecting them from atmospheric influences and preventing electrical breakdowns. What is more, its exceptional formula offers excellent chemical resistance to oxidation, aqueous solutions of acids, bases and salts, as well as sulphur dioxide and ammonia. In addition, it is highly resistant to the flow of electric current, which increases the safety of its use.
Wide range of applications
Whether you are working with modules featuring a high thermal conductivity coefficient, cooling devices, storage drive systems, motor control systems, power converters, high-power LEDs, notebooks, computers, network communication devices, household appliances, electronic and electrical components or air conditioners – H Silicone Thermal Paste is the ideal solution for a wide range of applications. Our product ensures trouble-free operation in a temperature range from -50°C to 250°C, with a density of 2.58 g/cm3.