High thermal conductivity: Silver Paste is a product enriched with silver compounds, providing thermal conductivity of >3.8 W/mK. This allows it to dissipate heat effectively, which is crucial for the optimal operation of your equipment. The paste is silver in colour, visually highlighting its advanced technology.
Versatile application: Ideal for filling microscopic irregularities between contacting elements, such as a processor and heatsink. It is also highly effective as a heat-transfer medium from the condenser of a heat pipe to the heat exchanger in vacuum solar collectors. Its versatile application makes it indispensable in computers and advanced heating systems.
Low thermal impedance and thermal stability: With a thermal impedance of less than 0.067 °C in2/W, Silver Paste minimises thermal resistance, resulting in better cooling and a longer service life for electronic components. It operates effectively across a wide temperature range from -50°C to 250°C, and temporarily even up to 340°C. It is ideal for applications requiring high reliability in extreme conditions.
Physicochemical properties: Silver Paste is characterised by a density of 2.37 g/cm3 at a temperature of 20°C and exceptionally low evaporation (